PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION FILM, INSULATING FILM, AND ELECTRONIC COMPONENT

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United States of America

APP PUB NO 20200019060A1
SERIAL NO

16494670

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A photosensitive resin composition contains an alkali-soluble polyimide (a), an unsaturated bond-containing compound (b), a heat-crosslinkable compound (c), and a photopolymerization initiator (d) having a structure represented by the following general formula (1):

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Patent Owner(s)

Patent OwnerAddress
TORAY INDUSTRIES INCJAPAN

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KANAMORI, Daisuke Shiga, JP 8 15
KATSURADA, Yuki Shiga, JP 3 0

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