CURED FILM-FORMING COMPOSITION
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United States of America
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Jan 16, 2020
app pub date -
Sep 20, 2017
filing date -
Sep 20, 2017
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Abstract
This cured film-forming resin composition is characterized in comprising: as a component (A), a polymer containing a structural unit derived from a first monomer having the structure with formula (1); a photoacid generator as a component (B); fine particles as a component (C); and a solvent (in the formula, R1 represents hydrogen or a methyl group and R2 represents an organic group capable of undergoing elimination with the oxygen atom bonded thereto). The cured film-forming resin composition forms a cured film that has solvent resistance to organic solvents and a high liquid repellency (lyophobicity) wherein the lyophilicity/lyophobicity can be easily varied using small ultraviolet exposure doses and the lyophilic areas have a high lyophilicity even for high surface tension liquids.
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