INTEGRATED CIRCUIT AND METHOD OF FORMING THE SAME
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Jan 16, 2020
app pub date -
Jul 2, 2019
filing date -
Jul 2, 2019
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Abstract
An integrated circuit includes a first set of devices, a set of metal layers and a header circuit. The first set of devices are configured to operate on a first supply voltage, and are located on a first layer of the integrated circuit. The set of metal layers are above the first layer, and includes a first metal layer and a second metal layer. The first metal layer extends in at least a first direction and a second direction. The header circuit is above the first set of devices. At least a portion of the header circuit is positioned between the first metal layer and the second metal layer. The header circuit is configured to provide the first supply voltage to the first set of devices, and is configured to be coupled to a second voltage supply having a second supply voltage different from the first supply voltage.
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