Plasma Source Having a Dielectric Plasma Chamber with Improved Plasma Resistance

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United States of America

APP PUB NO 20200022246A1
SERIAL NO

16035551

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A plasma chamber of a plasma processing system is provided. The plasma chamber defines a plasma channel having a first side and a second side oppositely disposed along a length of the plasma channel. The plasma chamber comprises a first section and a second section constructed from a dielectric material and an interface that bonds together the first and second sections at between a first flange of the first section and a third flange of the second section and between a second flange of the first section and a fourth flange of the second section.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Xing Lexington, US 122 2721
Gupta, Atul Lexington, US 123 1142
Pokidov, Ilya North Reading, US 11 38

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