METHOD OF FORMING WIRING ON SIDE PORTION OF SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200022263A1
SERIAL NO

16449476

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Disclosed is a method of forming wiring of a substrate includes masking a substrate side portion, on which the wiring will be formed, by attaching a deposition mask to the substrate; and forming the wiring on the substrate side portion based on sputtering after introducing the masked substrate into a chamber.

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Patent Owner(s)

Patent OwnerAddress
TETOS CO LTDCHUNGNAM
TETOS VACUUM EQUIPMENT (JIANGSU)CO LTDNO 15 PARK ROAD WUYOU STREET YANNAN HIGH TECH ZONE YANCHENG 224000

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
PARK, Yeong Ung Cheonan-si, KR 1 0
SONG, Kun Ho Asan-si, KR 6 10

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