HALFWAY CUTTER CHANGING METHOD FOR LARGE-AREA MICROSTRUCTURE CUTTING BASED ON IN-SITUATION FILM THICKNESS MEASUREMENT
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United States of America
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Jan 23, 2020
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Feb 18, 2019
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Feb 18, 2019
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Abstract
The present invention demonstrates a halfway cutter changing method for large-area microstructure cutting based on in-situation film thickness measurement, including the following steps: step 110: preparatory work; step 120: workpiece preliminary machining; step 130: transparent film coating; step 140: film thickness detection; step 150: halfway cutter changing; and step 160: machining completion. The halfway cutter changing method for the large-area microstructure cutting based on the in-situation film thickness measurement provided by the present invention implements machining of a microstructure with large area, high quality and high uniformity.
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