POLISHING APPARATUS AND POLISHING METHOD
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United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Jul 16, 2019
filing date -
Jul 16, 2019
priority date (Note) -
Published
status (Latency Note)
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Abstract
A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.
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