POLISHING APPARATUS AND POLISHING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200023486A1
SERIAL NO

16513251

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing apparatus capable of forming a step-shaped recess having a right-angled cross section in an edge portion of a substrate, such as a wafer, is disclosed. The polishing apparatus includes: a substrate rotating device configured to rotate the substrate about a rotation axis; a first roller having a first circumferential surface configured to press a polishing tape against the edge portion of the substrate; and a second roller having a second circumferential surface in contact with the first circumferential surface. The second roller has a tape stopper surface that restricts movement of the polishing tape in a direction away from the rotation axis. The tape stopper surface is located radially outward of the first circumferential surface.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kashiwagi, Makoto Tokyo, JP 19 47
Nakanishi, Masayuki Tokyo, JP 65 741
Seki, Masaya Tokyo, JP 44 242

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