POLISHING-PAD LAMINATED STRUCTURE, POLISHING-PAD POSITIONING INSTRUMENT, AND METHOD OF ATTACHING A POLISHING PAD TO A POLISHING TABLE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200023489A1
SERIAL NO

16426398

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing-pad laminated structure which allows for easy alignment of a through-hole of a polishing pad with a sensor head installed in a polishing table is disclosed. The polishing-pad laminated structure includes a polishing pad and a release sheet. The polishing pad has a through-hole located at a position corresponding to a position of a sensor head disposed in the polishing table. The release sheet covers an adhesive surface of the polishing pad. The release sheet is divided into at least a first release sheet and a second release sheet. The first release sheet has a surface area smaller than a surface area of the second release sheet.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kinoshita, Masaki Tokyo, JP 42 406
Kishi, Takashi Tokyo, JP 48 466
Nomura, Toshikazu Tokyo, JP 6 25
Sakugawa, Suguru Tokyo, JP 9 6
Takahashi, Nobuyuki Tokyo, JP 264 3210

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