POLISHING APPARATUS AND POLISHING METHOD FOR POLISHING A PERIPHERY OF A SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200023490A1
SERIAL NO

16455326

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A polishing apparatus capable of accurately detecting a polishing end point of a periphery of a substrate, such as a wafer, is disclosed. The polishing apparatus includes a polishing head configured to press a polishing tool against the periphery of the substrate on a substrate holding surface. The polishing head includes a pressing member configured to press the polishing tool against the periphery of the substrate, and a shear-force detection sensor configured to detect a shear force acting on the pressing member and output an index value indicating a magnitude of the shear force. An operation controller has a memory storing a program configured to determine a polishing end point at which the index value reaches a threshold value, and a processer configured to execute the program.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kodera, Kenji Tokyo, JP 18 65
Nakanishi, Masayuki Tokyo, JP 65 741

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