POLISHING APPARATUS AND POLISHING METHOD FOR POLISHING A PERIPHERY OF A SUBSTRATE
Number of patents in Portfolio can not be more than 2000
United States of America
Stats
-
N/A
Issued Date -
Jan 23, 2020
app pub date -
Jun 27, 2019
filing date -
Jun 27, 2019
priority date (Note) -
Published
status (Latency Note)
Importance
Abstract
A polishing apparatus capable of accurately detecting a polishing end point of a periphery of a substrate, such as a wafer, is disclosed. The polishing apparatus includes a polishing head configured to press a polishing tool against the periphery of the substrate on a substrate holding surface. The polishing head includes a pressing member configured to press the polishing tool against the periphery of the substrate, and a shear-force detection sensor configured to detect a shear force acting on the pressing member and output an index value indicating a magnitude of the shear force. An operation controller has a memory storing a program configured to determine a polishing end point at which the index value reaches a threshold value, and a processer configured to execute the program.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully