MEMS Devices and Methods of Fabrication Thereof

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200023642A1
SERIAL NO

16587912

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Abstract

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MEMS devices and methods of fabrication thereof are described. In one embodiment, the MEMS device includes a bottom alloy layer disposed over a substrate. An inner material layer is disposed on the bottom alloy layer, and a top alloy layer is disposed on the inner material layer, the top and bottom alloy layers including an alloy of at least two metals, wherein the inner material layer includes the alloy and nitrogen. The top alloy layer, the inner material layer, and the bottom alloy layer form a MEMS feature

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDTAIWAN 300-77

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Chun-Ren Hsinchu, TW 121 1201
Lee, Jiou-Kang Zhu-bei City, TW 37 291
Peng, Jung-Huei Jhubei City, TW 101 1110
Tsai, Shang-Ying Pingzhen City, TW 91 775
Wu, Ting-Hau Yilan City, TW 33 194

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