ROUGH LAYER FOR BETTER ANTI-STICTION DEPOSITION
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United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Apr 17, 2019
filing date -
Apr 17, 2019
priority date (Note) -
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Abstract
A microelectromechanical systems (MEMS) package with roughness for high quality anti-stiction is provided. A device substrate is arranged over a support device. The device substrate comprises a movable element with a lower surface that is rough and that is arranged within a cavity. A dielectric layer is arranged between the support device and the device substrate. The dielectric layer laterally encloses the cavity. An anti-stiction layer lines the lower surface of the movable element. A method for manufacturing the MEMS package is also provided.
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