THERMAL INTERFACE MATERIAL, METHOD FOR THERMALLY COUPLING WITH THERMAL INTERFACE MATERIAL, AND METHOD FOR PREPARING THERMAL INTERFACE MATERIAL

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United States of America

APP PUB NO 20200024144A1
SERIAL NO

16483386

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Abstract

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A thermal interface material for transferring heat by interposing between two materials may include a graphite film. The graphite film may have a thickness of 1 μm to 50 μm, a density of 1.40 g/cm3 to 2.26 g/cm3, a thermal conductivity of 500 W/mK to 2000 W/mK in a film plane direction, and an arithmetic average roughness Ra of 0.1 μm to 10 μm on a surface of the graphite film

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Patent Owner(s)

  • KANEKA CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Murakami, Mutsuaki Osaka, JP 83 779
Tachibana, Masamitsu Osaka, JP 23 51
Tatami, Atsushi Osaka, JP 17 10

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