PRESSURE SENSITIVE ADHESIVE WITH THERMALLY CONDUCTIVE RELEASE TAB

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200024491A1
SERIAL NO

16042347

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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Computing devices may require disassembly to repair or replace a defective or damaged component, or to facilitate recycling at the end of the computing device's service life. While pressure sensitive adhesive (PSA) is good at creating secure connections between components within the expected operating conditions of the computing device, PSA resists intentional disassembly of such components. The presently disclosed PSA with thermally conductive release tabs provides a mechanism for effective spot-cooling of the PSA between adhered components. Once the PSA reaches a low temperature threshold, one component may be mechanically separated from another component. This yields potentially faster and easier disassembly of adhered components than prior art techniques.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
LEE, Jason F Lynnwood, US 1 0
PARK, Randall J Bothell, US 1 0
YODER, Gregory Sammamish, US 2 22

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