USING MAGNETIC FIELDS TO INCREASE THE BONDING AREA OF AN ADHESIVE JOINT

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200024492A1
SERIAL NO

16194153

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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This application relates to an assembly technique for joining parts using a magnetic adhesive. A liquid adhesive including magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. A method for joining parts includes the steps of applying an adhesive to a substrate at a location corresponding to the joint, placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to cause the adhesive to flow in a direction corresponding to the magnetic field, and curing the magnetic adhesive under the influence of the magnetic field. An assembly fixture for joining parts includes a magnetic element and, optionally, an inductive heating element. The assembly technique can be used to form a housing of an electronic device from two or more components.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
DIFONZO, John C Emerald Hills, US 60 3035
EWING, Tyler J San Francisco, US 3 1
HERMAN, David S San Francisco, US 5 62
MORRIS, Nathan Los Gatos, US 16 132

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