USING MAGNETIC FIELDS TO INCREASE THE BONDING AREA OF AN ADHESIVE JOINT
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United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Nov 16, 2018
filing date -
Nov 16, 2018
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Abstract
This application relates to an assembly technique for joining parts using a magnetic adhesive. A liquid adhesive including magnetic particles is provided, the liquid adhesive having sufficient properties that allow the adhesive to flow under the influence of a magnetic field prior to curing. A method for joining parts includes the steps of applying an adhesive to a substrate at a location corresponding to the joint, placing a magnetic element proximate the joint to generate a magnetic field that interacts with the magnetic particles in the adhesive to cause the adhesive to flow in a direction corresponding to the magnetic field, and curing the magnetic adhesive under the influence of the magnetic field. An assembly fixture for joining parts includes a magnetic element and, optionally, an inductive heating element. The assembly technique can be used to form a housing of an electronic device from two or more components.
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