NOVEL ADHESIVE WITH SUBSTRATE COMPATIBILIZING PARTICLES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200024494A1
SERIAL NO

16042627

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A pair of bonded substrates having a first substrate of a first material, a second substrate of the first material, and an adhesive bonding the first substrate to the second substrate, wherein the adhesive has chemically linked compatibilizing particles compatible with the first and second substrates. A composition of matter has an adhesive having a chemically linked particle network forming a bond between a first substrate and a second substrate, wherein compatibilizing particles in the particle network are compatible with the first and second substrates. A method of joining two structures of identical materials includes preparing first and second structures to expose bare material, applying an adhesive to the bare material on the first and second structures, the adhesive containing compatibilizing particles compatible with the material and the preparing allows interaction between the material and the compatibilizing particles, and curing the adhesive.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
BEH, EUGENE SHIN MING Portola Valley, US 2 0
IFTIME, GABRIEL Dublin, US 217 1623
JOHNSON, DAVID MATHEW San Francisco, US 52 88
RIVEST, JESSICA LOUIS BAKER Palo Alto, US 20 10
WEI, JUNHUA Mountain View, US 4 0

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