THERMAL INTERFACE MATERIAL, METHOD FOR THERMALLY COUPLING WITH THERMAL INTERFACE MATERIAL, AND METHOD FOR PREPARING THERMAL INTERFACE MATERIAL

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United States of America

APP PUB NO 20200024496A1
SERIAL NO

16483395

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Abstract

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A thermal interface material for transferring heat by interposing between two materials may include a graphite film and a fluid substance. The graphite film may have a thickness of 100 nm to 15 μm, and a weight ratio of the fluid substance to the graphite film may be 0.08 to 25.

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Patent Owner(s)

Patent OwnerAddress
KANEKA CORPORATION2-3-18 NAKANOSHIMA KITA-KU OSAKA-SHI OSAKA 5308288

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Murakami, Mutsuaki Osaka, JP 88 957
Tachibana, Masamitsu Osaka, JP 25 113
Tatami, Atsushi Osaka, JP 18 64

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