SURFACTANT ADDITIVE TO INCREASE RESIN PIPE BONDING
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United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Dec 7, 2018
filing date -
Dec 7, 2018
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Abstract
In an embodiment, a resin formulation is provided. The resin formulation includes a curable resin; a hardener, wherein a concentration of hardener is from 15 wt % to 80 wt % based on a total weight of the curable resin; and a surfactant, wherein a concentration of surfactant is from 0.1 wt % to 5 wt % based on the total weight of the curable resin. In another embodiment, a method of treating a wellbore is provided. The method includes adding to a subterranean wellbore a volume of a resin formulation, the resin formulation comprising a curable resin, a hardener, and a surfactant; and allowing the resin formulation to form a sealant.
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