SENSOR PACKAGES

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200025786A1
SERIAL NO

16511433

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Abstract

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A sensor package comprising: a sensor, wherein the sensor comprises a sensing structure formed in a material layer and one or more further material layers arranged to seal the sensing structure to form a hermetically sealed sensor unit; a support structure; one or more springs flexibly fixing the hermetically sealed sensor unit to the support structure; wherein the one or more springs are formed in the same material layer as the sensing structure of the sensor unit; and one or more external package wall(s) encapsulating the sensor unit, the support structure, and the one or more springs, wherein the support structure is fixed to at least one of the package wall(s). The springs decouple mechanical stresses between the sensor unit and the external package wall(s) so as to reduce the long term drift of scale factor and bias.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HARISH, Kiran Plymouth, GB 3 3
MALVERN, Alan Plymouth, GB 15 49

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