ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE SAME

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200026119A1
SERIAL NO

16588461

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Abstract

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According to one embodiment, an electronic device includes a first substrate, a second substrate, an insulating film and a connecting material. The first substrate includes a first insulating substrate and a first conductive layer. The second substrate includes a second insulating substrate and a second conductive layer, and has a first through hole. The insulating film has a second through hole connected to the first through hole and penetrating to the first conductive layer. The connecting material is located in the first and the second through holes and electrically connects the first conductive layer and the second conductive layer. A width of the second through hole is less than a width of the first through hole.

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Patent Owner(s)

Patent OwnerAddress
JAPAN DISPLAY INC3-7-1 NISHI-SHINBASHI MINATO-KU TOKYO 105-0003

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
HINATA, Shoji Tokyo, JP 57 1167
IMAZEKI, Yoshikatsu Tokyo, JP 70 452
KAMIJO, Yoichi Tokyo, JP 44 177
OSAWA, Shuichi Tokyo, JP 45 182
WATANABE, Yoshihiro Tokyo, JP 237 3078

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