EXTENDED PACKAGE AIR CORE INDUCTOR
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United States of America
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Issued Date -
Jan 23, 2020
app pub date -
May 3, 2019
filing date -
May 3, 2019
priority date (Note) -
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Abstract
An electronic device comprises an air core inductor including an electronic semiconductor package including a first portion of the air core inductor internal to the electronic semiconductor package; and an electrically conductive layer arranged on a first external surface of the electronic semiconductor package and electrically connected as a second portion of the air core inductor.
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