EXTENDED PACKAGE AIR CORE INDUCTOR

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200027639A1
SERIAL NO

16402467

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Abstract

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An electronic device comprises an air core inductor including an electronic semiconductor package including a first portion of the air core inductor internal to the electronic semiconductor package; and an electrically conductive layer arranged on a first external surface of the electronic semiconductor package and electrically connected as a second portion of the air core inductor.

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Patent Owner(s)

  • Owner owned or assignment not recorded

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Goh, Eng Huat Penang, MY 49 100
Kuan, Chin Lee Bayan Lepas, MY 15 0
Lim, Min Suet Simpang Ampat, MY 49 94
Sir, Jiun Hann Gelugor, MY 25 64
Yap, Siew Fong Bayan Lepas, MY 1 0

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