APPARATUS AND METHOD FOR TREATING SUBSTRATE
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United States of America
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Jan 23, 2020
app pub date -
Jul 19, 2019
filing date -
Jul 19, 2019
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Abstract
An apparatus for treating a substrate comprises a chamber having a processing space in which a process of treating the substrate is performed and a fluid supply unit that supplies a treating fluid into the chamber. The fluid supply unit comprises a supply line, at least one orifice provided in the supply line, and a first heater provided on the orifice or upstream of the orifice. The first heater heats the treating fluid passing through the orifice to a set temperature or more.
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