APPARATUS AND METHOD FOR TREATING SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200027724A1
SERIAL NO

16516905

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An apparatus for treating a substrate comprises a chamber having a processing space in which a process of treating the substrate is performed and a fluid supply unit that supplies a treating fluid into the chamber. The fluid supply unit comprises a supply line, at least one orifice provided in the supply line, and a first heater provided on the orifice or upstream of the orifice. The first heater heats the treating fluid passing through the orifice to a set temperature or more.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
JUNG, JINWOO Seoul, KR 21 23
LEE, YONG HEE Cheonan-si, Chungcheongnam-do, KR 59 434
LEE, YOUNG HUN Cheonan-si, Chungcheongnam-do, KR 23 21
LIM, EUI SANG Cheonan-si, Chungcheongnam-do, KR 6 2

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