SEALING SHEET AND SEMICONDUCTOR-DEVICE MANUFACTURING METHOD

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United States of America

APP PUB NO 20200027754A1
SERIAL NO

16488058

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Abstract

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A sealing sheet is provided which is used for sealing of a semiconductor chip embedded in a substrate or a semiconductor chip on a pressure sensitive adhesive sheet in a method of manufacturing a semiconductor device. The method includes a treatment step using an alkaline solution. The sealing sheet includes at least an adhesive layer having curability. The adhesive layer is formed of an adhesive composition that contains a thermoset resin, a thermoplastic resin, and an inorganic filler. The inorganic filler is surface-treated with a surface treatment agent having a minimum coverage area of less than 550 m2/g. With the sealing sheet, blisters in plating are less likely to occur.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
NEZU, Yusuke Tokyo, JP 3 2
SUGINO, Takashi Tokyo, JP 61 734
WATANABE, Yasutaka Tokyo, JP 16 71

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