BRUSH CLEANING APPARATUS, CHEMICAL-MECHANICAL POLISHING (CMP) SYSTEM AND WAFER PROCESSING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200027760A1
SERIAL NO

16587788

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Abstract

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The present disclosure, in some embodiments, relates to a brush cleaning apparatus. The brush cleaning apparatus includes a wafer support configured to support a wafer. The brush cleaning apparatus also includes a cleaning brush including a porous material coupled to a core material. An uppermost surface of the porous material defines a planar cleaning surface. A first nozzle is configured to apply a first cleaning liquid directly between the wafer and the planar cleaning surface of the cleaning brush.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Chang-Sheng Baoshan Township, TW 41 46
Lu, Hsin-Hsien Hsinchu City, TW 31 178

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