PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE
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United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Sep 30, 2019
filing date -
Sep 30, 2019
priority date (Note) -
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Abstract
A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.
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