PACKAGE ASSEMBLY FOR THIN WAFER SHIPPING AND METHOD OF USE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200027766A1
SERIAL NO

16588082

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Abstract

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A package assembly for thin wafer shipping using a wafer container and a method of use are disclosed. The package assembly includes a shipping container and a wafer container having a bottom surface and a plurality of straps attached thereto placed within the shipping container. The package assembly further includes upper and lower force distribution plates provided within the shipping container positioned respectively on a top side and bottom side thereof.

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  • Owner owned or assignment not recorded

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Corbin, Damyon L Jericho, US 8 3
Musante, Charles F Burlington, US 36 236

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