METHODS FOR EDGE TRIMMING OF SEMICONDUCTOR WAFERS AND RELATED APPARATUS

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United States of America

APP PUB NO 20200027773A1
SERIAL NO

16042597

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Abstract

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Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

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Patent Owner(s)

Patent OwnerAddress
MICRON TECHNOLOGY INC8000 SOUTH FEDERAL WAY BOISE ID 83716-9632

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lin, Jing-Cheng Hsinchu City, TW 444 6392

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