METHODS FOR EDGE TRIMMING OF SEMICONDUCTOR WAFERS AND RELATED APPARATUS

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Jan 23, 2020
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Jul 23, 2018
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Jul 23, 2018

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Abstract

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

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MICRON TECHNOLOGY INC	8000 SOUTH FEDERAL WAY MAILSTOP 1-507 BOISE ID 83707-0006

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Inventor Name	Address	# of filed Patents	Total Citations
Lin, Jing-Cheng	Hsinchu City, TW	565	14856

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METHODS FOR EDGE TRIMMING OF SEMICONDUCTOR WAFERS AND RELATED APPARATUS

Number of patents in Portfolio can not be more than 2000

United States of America

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