Multi-Die Fine Grain Integrated Voltage Regulation
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Aug 1, 2019
filing date -
Aug 1, 2019
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Abstract
A semiconductor device package is described that includes a power consuming device (such as an SOC device). The power consuming device may include one or more current consuming elements. A passive device may be coupled to the power consuming device. The passive device may include a plurality of passive elements formed on a semiconductor substrate. The passive elements may be arranged in an array of structures on the semiconductor substrate. The power consuming device and the passive device may be coupled using one or more terminals. The passive device and power consuming device coupling may be configured in such a way that the power consuming device determines functionally the way the passive device elements will be used.
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