PRINTED CIRCUIT BOARD INCLUDING SUB-CIRCUIT BOARD
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Jan 23, 2020
app pub date -
Sep 30, 2019
filing date -
Sep 30, 2019
priority date (Note) -
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status (Latency Note)
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Abstract
A printed circuit board includes: a core member including a through-hole; a sub-circuit board disposed in the through-hole; a first insulating layer disposed on opposing surfaces of the core member and opposing surfaces of the sub-circuit board; and an insulating material disposed between an inner wall of the through-hole and the sub-circuit board.
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