THIN-FILM ELECTRODE ASSEMBLY WITH SOFT OVERMOLD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200030599A1
SERIAL NO

16589518

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present disclosure relates to implantable neuromodulation devices and methods of fabrication, and in particular to a thin-film electrode assemblies and methods of fabricating the thin-film electrode assembly to include a soft overmold. Particularly, aspects of the present invention are directed to a thin-film electrode assembly that includes an overmold and a supporting structure formed within a portion of the overmold. The overmold includes a first polymer and the supporting structure includes a second polymer, different from the first polymer. The thin-film electrode assembly also includes a wire formed within a portion of the supporting structure, and an electrode formed on a top surface of the supporting structure and in electrical contact with the wire.

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Patent Owner(s)

Patent OwnerAddress
VERILY LIFE SCIENCES LLC269 E GRAND AVE SOUTH SAN FRANCISCO CA 94080

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Lu, Bo Santa Clara, US 47 540
Pepin, Brian San Francisco, US 16 81
Sabesan, Shiv San Mateo, US 4 1

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