SPLITTING APPARATUS AND SPLITTING METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200038976A1
SERIAL NO

16426508

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A splitting apparatus includes: a lower mold configured to allow placement of a plate material on the lower mold and arranged on a first side with respect to a split target line of the plate material; an upper blade configured to be raised or lowered with respect to the lower mold; and a support member arranged on a second side with respect to the split target line of the plate material. The splitting apparatus is configured that, in a case where the upper blade is lowered with respect to the lower mold in a state where the plate material is supported by the lower mold and the support member, a cut is formed on the split target line of the plate material by the upper blade, a crack is formed in conjunction with formation of the cut, and the plate material is split along the split target line.

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Patent Owner(s)

Patent OwnerAddress
TOYOTA JIDOSHA KABUSHIKI KAISHATOYOTA-SHI AICHI-KEN 471-8571

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Takahiro Toyota-shi, JP 72 441
Miura, Masayuki Toyota-shi, JP 43 420
Sakakibara, Nobuyuki Toyota-shi, JP 2 0

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