APPARATUS AND METHODS FOR CHEMICAL MECHANICAL POLISHING
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United States of America
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Feb 6, 2020
app pub date -
Jul 24, 2019
filing date -
Jul 24, 2019
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Abstract
An apparatus for CMP includes a platen, a wafer carrier retaining a semiconductor wafer during a polishing operation, a dress configured to recondition a polishing pad disposed on the platen during the polishing operation, and a vibration-monitoring system configured to detect vibrations during the polishing operation. The vibration-monitoring system includes a first vibration sensor configured to generate a plurality of first vibration signals. An end point is triggered to the polishing when a change between the plurality of vibration signals reaches a value.
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