Importance

Loading Importance Indicators...

Abstract

Provided is a method of double-side polishing a semiconductor wafer, which can suppress variation in the polishing quality by providing for changes in the polishing environment during polishing. The method of double-side polishing of a semiconductor wafer includes: a step of predetermining a criterion function for determining polishing tendencies of double-side polishing; a first step of starting double-side polishing of the semiconductor wafer under initial polishing conditions; a second step of while performing double-side polishing on the semiconductor wafer under the initial polishing conditions, calculating a value of the criterion function using the apparatus log data in a predetermined period of polishing in the first step, and setting on the double-side polishing apparatus polishing conditions obtained by adjusting the initial polishing conditions based on the value of the criterion function; and a third step of performing double-side polishing of the semiconductor wafer under the adjusted polishing conditions.

Loading the Abstract Image...

First Claim