THIN FILM FORMING METHOD AND POROUS THIN FILM

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200041694A1
SERIAL NO

16523855

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Abstract

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A thin film forming method includes: attaching a mixture of a dielectric material and a fluorocarbon resin as a first layer on a substrate; and thereafter attaching only a dielectric material as a second layer on the first layer to form a two-layer thin film on the substrate. The method is capable of manufacturing a thin film whose production is easy and costs low, whose substances attached by vapor deposition or the like do not easily suffer cracking, peeling, breakage, and so on, and in which a low refractive index is achieved in a wide band by freely controlling its packing ratio.

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Patent Owner(s)

Patent OwnerAddress
OKAMOTO OPTICS INC8-34 HARAMACHI ISOGO-KU YOKOHAMA-SHI KANAGAWA 235-0008

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
OKAMOTO, Takayuki Yokohama-shi, JP 54 198
YOSHIDA, Kunio Neyagawa-shi, JP 59 1814

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