Methods and Apparatuses for Drying Electronic Devices
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United States of America
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Issued Date -
Feb 13, 2020
app pub date -
Sep 18, 2019
filing date -
Sep 18, 2019
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Abstract
Methods and apparatuses for drying electronic devices are disclosed. Embodiments include methods and apparatuses that heat and decrease pressure within the electronic device. Some embodiments increase and decrease pressure while adding heat energy, such as by using a heated platen in contact with the electronic device or by supplying a gas (e.g., air), which may be heated, into the interior of the electronic device.
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