EPITAXIAL SILICON WAFER AND METHOD FOR MANUFACTURING EPITAXIAL SILICON WAFER

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United States of America

APP PUB NO 20200051817A1
SERIAL NO

16339941

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Abstract

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A manufacturing method of an epitaxial silicon wafer includes: an epitaxial-film formation step for forming an epitaxial film made of silicon on a surface of a silicon wafer in a trichlorosilane gas atmosphere; and a nitrogen-concentration setting step for setting the nitrogen concentration of the surface of the epitaxial film through inward diffusion from a nitride film on the epitaxial film, the nitride film being formed by subjecting the silicon wafer provided with the epitaxial film through the epitaxial-film formation step to a heat treatment in a nitrogen atmosphere.

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Patent Owner(s)

Patent OwnerAddress
SUMCO CORPORATIONMINATO-KU TOKYO 105-8634

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
KODANI, Kazuya Tokyo, JP 19 85
ONO, Toshiaki Tokyo, JP 130 983
TORIGOE, Kazuhisa Tokyo, JP 9 9

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