APPARATUSES AND METHODS FOR IMPLEMENTING A SLIDING THERMAL INTERFACE BETWEEN SUBSTRATES WITH VARYING COEFFICIENTS OF THERMAL EXPANSION
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United States of America
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Feb 13, 2020
app pub date -
Aug 12, 2019
filing date -
Aug 12, 2019
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Abstract
Systems and methods include an integrated circuit assembly that includes a semiconductor substrate; a heat transfer element; and an ambulatory thermal interface arranged between the semiconductor substrate and the heat transfer element, the ambulatory thermal interface comprising: a thermally conductive material, and a friction reduction material, wherein: the thermally conductive material is arranged along a surface of the heat transfer element, the friction reduction material is arranged along a surface of the semiconductor substrate, opposing surfaces of the thermally conductive material and the friction reduction material define a slidable interface when placed in contact.
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