MEMS ISOLATION STRUCTURES
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United States of America
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Issued Date -
Feb 20, 2020
app pub date -
Aug 23, 2019
filing date -
Aug 23, 2019
priority date (Note) -
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Abstract
A device may comprise a substrate formed of a first semiconductor material and a trench formed in the substrate. A second semiconductor material may be formed in the trench. The second semiconductor material may have first and second portions that are isolated with respect to one another and that are isolated with respect to the first semiconductor material.
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