Importance

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Abstract

Embodiments of semiconductor structures for wafer flatness control and methods for using and forming the same are disclosed. In an example, a model indicative of a flatness difference of a wafer between a first direction and a second direction is obtained. The flatness difference is associated with one of a plurality of fabrication stages of a plurality of semiconductor devices on a front side of the wafer. A compensation pattern is determined for reducing the flatness difference based on the model. At the one of the plurality of the fabrication stages, a compensation structure is formed on a backside opposite to the front side of the wafer based on the compensation pattern to reduce the flatness difference.

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First Claim