HEAT DISSIPATION IN AN ELECTRONIC CIRCUIT AND METHOD

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200060035A1
SERIAL NO

16543722

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.

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Patent Owner(s)

Patent OwnerAddress
COMET AGNot Provided

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hansen, Ulrich Stolberg, DE 2 2

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