HEAT DISSIPATION IN AN ELECTRONIC CIRCUIT AND METHOD
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United States of America
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Issued Date -
Feb 20, 2020
app pub date -
Aug 19, 2019
filing date -
Aug 19, 2019
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Abstract
An electronic circuitry module and a method of potting an electronic circuit are provided. The electronic circuit module includes at least one heat generating electronic component and is potted in a potting material. Additionally, a cooling circuit is potted in the potting material. The cooling circuit includes an inlet and an outlet for flow of cooling liquid therebetween.
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