ATOMIC LAYER DEPOSITION APPARATUS AND FILM-FORMING METHOD
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United States of America
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Issued Date -
Feb 27, 2020
app pub date -
Aug 12, 2019
filing date -
Aug 12, 2019
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Abstract
An atomic layer deposition apparatus includes a chamber, a stage which is disposed in the chamber and over which a substrate is placed, an opening which is provided in a side wall of the chamber, an opening and closing part which is connected to the opening, and a movable adhesion preventing member disposed in the chamber. The opening is an opening for transferring the substrate. The adhesion preventing member is located at a position where it covers the opening in a state where the opening and closing part is closed.
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