REDISTRIBUTION LAYERS INCLUDING REINFORCEMENT STRUCTURES AND RELATED SEMICONDUCTOR DEVICE PACKAGES, SYSTEMS AND METHODS
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United States of America
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Feb 27, 2020
app pub date -
Aug 21, 2018
filing date -
Aug 21, 2018
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Abstract
Embodiments of a redistribution layer structure comprise a low-k dielectric material and incorporating a reinforcement structure proximate and inward of a peripheral edge thereof, the reinforcement structure comprising conductive material electrically isolated from conductive paths through the RDL structure. Semiconductor packages including an embodiment of the RDL structure and methods of fabricating such RDL structures are also disclosed.
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