LIGHT EMITTING DIODE PACKAGE
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Feb 27, 2020
app pub date -
Oct 31, 2019
filing date -
Oct 31, 2019
priority date (Note) -
Published
status (Latency Note)
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Abstract
A light emitting diode package includes an upper housing and a lower housing. The upper housing includes a first light emitting diode (LED) chip arranged therein, a second LED chip arranged to be spaced apart from the first LED chip in a first direction, two light discharge structures, first electrodes formed on a lower surface of the first LED chip, and second electrodes formed on a lower surface of the second LED chip. The lower housing includes at least three grooves at a lower surface thereof. The lower housing further includes three or more pads. The first pair of via-holes are arranged to connect the first electrodes to one or more of the pads in a second direction perpendicular to the first direction. The second pair of via-holes are arranged to connect the second electrodes to one or more of the pads in the second direction.
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Cited Art Landscape
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