Chemical Mechanical Planarization For Tungsten-Containing Substrates
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United States of America
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Mar 12, 2020
app pub date -
Sep 4, 2019
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Sep 4, 2019
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Abstract
Chemical mechanical polishing (CMP) compositions, systems and methods of using the compositions for polishing tungsten or tungsten-containing substrates. The compositions comprise nano-sized abrasive; metal compound coated organic polymer particles as solid state catalyst; oxidizer; tungsten corrosion inhibitor; and a water based liquid carrier.
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