SENSOR WITH INTEGRATED HEATER
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United States of America
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Issued Date -
Mar 19, 2020
app pub date -
Sep 17, 2019
filing date -
Sep 17, 2019
priority date (Note) -
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Abstract
A device includes a microelectromechanical system (MEMS) sensor die comprising a deformable membrane, a MEMS heating element, and a substrate. The MEMS heating element is integrated within a same layer and a same plane as the deformable membrane. The MEMS heating element surrounds the deformable membrane and is separated from the deformable membrane through a trench. The MEMS heating element is configured to generate heat to heat up the deformable membrane. The substrate is coupled to the deformable membrane.
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