COMPOSITION FOR SELECTIVE POLISHING OF WORK FUNCTION METALS
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United States of America
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Mar 19, 2020
app pub date -
Sep 14, 2018
filing date -
Sep 14, 2018
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Abstract
Provided herein are methods and compositions for selective polishing of a work function metal containing substrate. The present methods and compositions involve the use of a liquid carrier an anionic surfactant and a colloidal silica particle. The present methods and compositions can be used to achieve selective polishing of the work function metal.
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