MULTI-LAYER SUSCEPTOR ASSEMBLY FOR INDUCTIVELY HEATING AN AEROSOL-FORMING SUBSTRATE

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200093179A1
SERIAL NO

16494848

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to a multi-layer susceptor assembly for inductively heating an aerosol-forming substrate which comprises at least a first layer and a second layer intimately coupled to the first layer. The first layer comprises a first susceptor material. The second layer comprises a second susceptor material having a Curie temperature lower than 500° C. The susceptor assembly further comprises a third layer intimately coupled to the second layer. The third layer comprises a specific stress-compensating material and specific layer thickness for compensating differences in thermal expansion occurring in the multi-layer susceptor assembly after a processing of the assembly such that at least in a compensation temperature range an overall thermal deformation of the susceptor assembly is essentially limited to in-plane deformations. The compensation temperature range extends at least from 20 K below the Curie temperature of the second susceptor material up to the Curie temperature of the second susceptor material.

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Patent Owner(s)

Patent OwnerAddress
PHILIP MORRIS PRODUCTS S AQUAI JEANRENAUD 3 CH-2000 NEUCHÂTEL SWITZERLAND

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fursa, Oleg Gempenach, CH 47 267
Rossoll, Andreas Michael Mont-sur-Lausanne, CH 16 12

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