METHOD OF MANUFACTURING MICROCHANNEL CHIP

Number of patents in Portfolio can not be more than 2000

United States of America

APP PUB NO 20200094249A1
SERIAL NO

16495543

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Abstract

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Disclosed is method of manufacturing a microchannel chip by joining together a resin channel substrate having microchannels formed on at least one side thereof and a resin lid substrate, the method including: a step (A) wherein surface modification treatment is applied on joining surfaces of the channel substrate and the lid substrate; and a step (B) wherein, after the step (A), the joining surfaces of the channel substrate and the lid substrate are mated and the channel substrate and the lid substrate are pressurized under heating via a fluid or an elastic body having a durometer hardness of E20 or less.

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Patent Owner(s)

Patent OwnerAddress
ZEON CORPORATION6-2 MARUNOUCHI 1-CHOME CHIYODA-KU TOKYO 100-8246

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
AIZAWA, Mitsukazu Chiyoda-ku, Tokyo, JP 1 0
ARAI, Kunihito Chiyoda-ku, Tokyo, JP 6 22
ARITOME, Noriyuki Chiyoda-ku, Tokyo, JP 1 0
CHIBA, Daido Chiyoda-ku, Tokyo, JP 14 14
SAWAGUCHI, Taichi Chiyoda-ku, Tokyo, JP 16 17

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