METHOD OF FORMING COOLING HOLES
Number of patents in Portfolio can not be more than 2000
United States of America
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Issued Date -
Mar 26, 2020
app pub date -
Sep 21, 2018
filing date -
Sep 21, 2018
priority date (Note) -
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status (Latency Note)
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Abstract
A method of forming a film cooling hole in a component having an internal surface and an external surface is disclosed herein that includes forming the component with a first feature on the external surface, measuring a geometry of the external surface to determine a first placement of the first feature, and drilling the film cooling hole through the component at the first placement.
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