ZONE-BASED CMP TARGET CONTROL
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United States of America
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Mar 26, 2020
app pub date -
Aug 12, 2019
filing date -
Aug 12, 2019
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Abstract
The present disclosure is directed to techniques of zone-based target control in chemical mechanical polishing of wafers. Multiple zones are identified on a surface of a wafer. The CMP target is achieved on each zone in a sequence of CMP processes. Each CMP process in the sequence achieves the CMP target for only one zone, using a CMP process selective to other zones.
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