MEMS TRANSDUCER PACKAGE AND A MEMS DEVICE INCLUDING THE SAME
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United States of America
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Issued Date -
Mar 26, 2020
app pub date -
Nov 27, 2019
filing date -
Nov 27, 2019
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Abstract
A microelectromechanical sensors (MEMS) device includes a first substrate, a MEMS transducer package attached on the first substrate and including a MEMS transducer therein configured to output an electrical signal corresponding to movement of fluid, and a semiconductor device attached on the first substrate and configured to process the electrical signal provided from the MEMS transducer.
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